ProgramMaster Logo
Conference Tools for 2023 TMS Annual Meeting & Exhibition
Register as a New User
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Symposium
Meeting 2023 TMS Annual Meeting & Exhibition
Symposium Electronic Packaging and Interconnection
Sponsorship TMS Functional Materials Division
TMS: Electronic Packaging and Interconnection Materials Committee
Organizer(s) Kazuhiro Nogita, University of Queensland
Mohd Arif Anuar Mohd Salleh, Universiti Malaysia Perlis
Dan Li, Beijing University of Technology
David P. Yan, San Jose State University
Fan-Yi Ouyang, National Tsing Hua University
Patrick Shamberger, Texas A&M University
Tae-Kyu Lee, Cisco Systems
Christopher M. Gourlay, Imperial College London
Albert T. Wu, National Central University
Scope Continuing advances in microelectronic, opto-electronic and nano-electronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current research in packaging materials and processes, including Pb free solders, alternative interconnects, conductive adhesives, epoxy, substrates, 3D packaging, wafer level packaging, quality, reliability, and failure analysis.

Topics of interest include, but are not limited to:
* Packaging materials and processes for next generation packages, e.g., 3D packaging, wafer level packaging, photonic packaging, Internet of Things (IoT), flexible electronics, wire bonding, automotive and power electronics.
* Interconnects for packages, e.g., Pb-free solder, micro bumps, Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive adhesive, optoelectronic interconnects, transient liquid phase bonding, sintered nano-powder joints, polymer core solder balls and alternative interconnect materials at chip and package levels.
*Additive manufacturing and 3D printing for electronics industry
* Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal interface material (TIM), substrate materials and process.
* Quality, Reliability, and failure analysis for next generation packages.
* Continuing challenges in implementing Pb-free solders for interconnect, plating and thermal interface material (TIM) applications
* Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and intermetallic compounds

Abstracts Due 07/17/2022
Proceedings Plan Planned:

Ball Drift in SnAgCu/SnBi Hydrid Joints during Thermal Cycling
Characterising the thermal expansion behaviour in In-Sn superconducting solder joints by in-situ synchrotron powder X-ray diffraction
Current-enhanced Presureless Sintering of Cu Nanoparticles at Room Temperature
Dynamic Material Characterization Through In-Situ Electrical Resistivity Measurements of High Temperature Transient Liquid Phase Sinter Alloys
Effect of joint length scale on creep deformation of Sn-rich dissimilar metallic joints
Effect of Synthesized Variables on Characteristics for Cu Nanoparticle
Effects of anisotropic Indium solder on Cu diffusion under a temperature gradient
Effects of Diameter on Copper Pillar with Solder Cap Interconnections during Reflow Soldering Process
Effects of Different Surface Finish to the Microstructure and Properties of Sn-Ag Solder Joints
Flexible packaging by microwave bonding for flexible electronics
Impact of Non-linear Phase Change Processes on Thermal Impedance of an Electronics Package
In-situ observation of the Ga and Cu/Cu6Ni reaction by synchrotron microradiography
Influences of deposition speed on void formation in electroless copper plating film for micro-vias
Investigation of Corrosion for Ni-based Surface Finish
Kinetics of the Accumulation of Bismuth at the anode of a Sn-Bi based solder joint during Current Stressing
Low-temperature CMOS compatible SLID & Eutectic Bonding for Wafer Level Packaging
Low melting temperature solder interconnect Thermo-mechanical performance enhancement using elemental tuning
Low Temperature Direct Bonding in Atmosphere by nanocrystalline Ag
Microalloying Effects of Sb and Ag on the Strain-Rate Sensitivity and Microstructural Evolution of Eutectic SnBi Alloys
Microstructural Effect of Cu Substrate on Join Properties for Cu-to-Cu Direct Bonding
Microstructure formation and room temperature creep behavior of Sn-Bi-Ag solder alloys
Mitigation of tin whiskers growth by co-electroplating Sb
Network Structure and Viscoelasticity of Flexible Electronic Interconnects based on Linear Low-density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites
New insights into the nucleation and growth of Ag3Sn plates in solder joints
No-Flow Electroless Connections for Die-to-Wafer Attach
On the thermal aging of the nanoporous structure of sintered Ag on a Cu substrate
Pad Connectivity Induced Capacitance Effect in Electroless Copper Plating Interconnection
Phase-field modeling of electromigration-mediated void migration and coalescence under mechanical compression
Phase-field simulation of deposition profile and microstructure of thin film on nonplanar substrate
Power Cycling Reliability with Temperature Deviation of Pressureless Silver Sinter Joint for Silicon Carbide Power Module
Probing defect formation and reliability of solder interconnects produced through quasi-ambient bonding
Properties of Sn-3wt%Ag-5wt%Cu alloys with Cu6Sn5 intermetallic grain refined by Mg
Sintered Ag-In Alloy Paste as Die-attach Material for Power Electronic Packaging
Study of Sn-Bi-In ternary solders with compositions of lines between binary eutectic points to ternary eutectic points
Surface Precipitation and growth of Bismuth particles in Sn-Bi solder alloys
The effect of grain boundary type on void formation in a Through Silicon Via (TSV)
The effect of Ni Microalloying on the Microstructure Evolution of In-35wt.% Sn Solder Alloy
The effects of Sb on the properties of hypo-eutectic Sn-Bi alloys
Thermal Instability of Nanocrystalline Cu Enables Cu-Cu Direct Bonding in Interconnects at Low Temperature
Thermomigration of Liquid Indium and Nickel Thin Film During Bonding Process

Questions about ProgramMaster? Contact