About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Thermomigration of Liquid Indium and Nickel Thin Film During Bonding Process |
Author(s) |
Po-Hsun Yang, Fan-Yi OuYang |
On-Site Speaker (Planned) |
Po-Hsun Yang |
Abstract Scope |
The internet of things (IOT) has been developed over the past decade. However, most sensors in IOT system have a low heat tolerance. Therefore, indium-based solder, which have a lower melting temperature, is regarded as the substitute for traditional tin-based solder during solid liquid interdiffusion bonding (SLID) process. In this study, we investigate thermomigration behavior between liquid-state Indium and nickel under bump metallization (UBM) thin film under a temperature gradient. The microstructure evolution of intermetallic compounds (IMCs) under thermomigration would be examined and compared to isothermal cases. In addition, through the marker experiment, the dominant diffusion species in In/Ni system would be found. The growth mechanism of IMCS at hot end and cold end during SLID process would be discussed. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Thin Films and Interfaces, Phase Transformations |