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Meeting 2023 TMS Annual Meeting & Exhibition
Symposium Electronic Packaging and Interconnection
Presentation Title Kinetics of the Accumulation of Bismuth at the Anode of a Sn-Bi Based Solder Joint during Current Stressing
Author(s) Eric J. Cotts, Faramarz Hadian, Javier Flores, Sitaram Panta, Mohammed Genanu
On-Site Speaker (Planned) Eric J. Cotts
Abstract Scope The evolution of the microstructure of SnBi-based solder joints during current stressing was examined using scanning electron microscopy, and in-situ measurements of electrical resistance. A Bi layer was observed to accumulate at the anode at a linear rate. A correlated increase in the electrical resistance was observed (eventually exceeding the standard JEDEC failure criteria of twenty percent). An expression for the rate of increase of the thickness of the Bi layer was generated from simple diffusion theory, and fit to the data at temperatures between 60 and 125oC, and current densities between 2,000 and 9,000 A/cm2. This expression was related to a specific form of Black's equation for mean time to failure (one inversely proportional to current density, with an apparent activation energy of 1 eV), that produced a good fit to the data for failure times.
Proceedings Inclusion? Planned:
Keywords Electronic Materials, Modeling and Simulation, Characterization

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

Ball Drift in SnAgCu/SnBi Hydrid Joints during Thermal Cycling
C-7: Dynamic Material Characterization through In-Situ Electrical Resistivity Measurements of High Temperature Transient Liquid Phase Sinter Alloys
C-8: Low-temperature CMOS Compatible SLID & Eutectic Bonding for Wafer Level Packaging
Characterising the Thermal Expansion Behaviour in In-Sn Superconducting Solder Joints by In-situ Synchrotron Powder X-ray Diffraction
Current-enhanced Presureless Sintering of Cu Nanoparticles at Room Temperature
Effect of Joint Length Scale on Creep Deformation of Sn-rich Dissimilar Metallic Joints
Effect of Synthesized Variables on Characteristics for Cu Nanoparticle
Effects of Anisotropic Indium Solder on Cu Diffusion under a Temperature Gradient
Effects of Diameter on Copper Pillar with Solder Cap Interconnections during Reflow Soldering Process
Effects of Different Surface Finish to the Microstructure and Properties of Sn-Ag Solder Joints
Flexible Packaging by Microwave Bonding for Flexible Electronics
Impact of Non-linear Phase Change Processes on Thermal Impedance of an Electronics Package
In-situ Observation of the Ga and Cu/Cu6Ni Reaction by Synchrotron Microradiography
Influences of Deposition Speed on Void Formation in Electroless Copper Plating Film for Micro-vias
Investigation of Corrosion for Ni-based Surface Finish
Kinetics of the Accumulation of Bismuth at the Anode of a Sn-Bi Based Solder Joint during Current Stressing
Low Melting Temperature Solder Interconnect Thermo-mechanical Performance Enhancement Using Elemental Tuning
Low Temperature Direct Bonding in Atmosphere by Nanocrystalline Ag
Microalloying Effects of Sb and Ag on the Strain-Rate Sensitivity and Microstructural Evolution of Eutectic SnBi Alloys
Microstructural Effect of Cu Substrate on Join Properties for Cu-to-Cu Direct Bonding
Mitigation of Tin Whiskers Growth by Co-electroplating Sb
Network Structure and Viscoelasticity of Flexible Electronic Interconnects based on Linear Low-density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites
New Insights into the Nucleation and Growth of Ag3Sn Plates in Solder Joints
No-Flow Electroless Connections for Die-to-Wafer Attach
On the Thermal Aging of the Nanoporous Structure of Sintered Ag on a Cu Substrate
Pad Connectivity Induced Capacitance Effect in Electroless Copper Plating Interconnection
Phase-field Modeling of Electromigration-mediated Void Migration and Coalescence under Mechanical Compression
Phase-field Simulation of Deposition Profile and Microstructure of Thin Film on Nonplanar Substrate
Power Cycling Reliability with Temperature Deviation of Pressureless Silver Sinter Joint for Silicon Carbide Power Module
Probing Defect Formation and Reliability of Solder Interconnects Produced through Quasi-ambient Bonding
Properties of Sn-3wt%Ag-5wt%Cu Alloys with Cu6Sn5 Intermetallic Grain Refined by Mg
Sintered Ag-In Alloy Paste as Die-attach Material for Power Electronic Packaging
Study of Sn-Bi-In Ternary Solders with Compositions of Lines between Binary Eutectic Points to Ternary Eutectic Points
Surface Precipitation and Growth of Bismuth Particles in Sn-Bi Solder Alloys
The Effect of Grain Boundary Type on Void Formation in a Through Silicon Via (TSV)
The Effect of Ni Microalloying on the Microstructure Evolution of In-35wt.% Sn Solder Alloy
The Effects of Sb on the Properties of Hypo-eutectic Sn-Bi Alloys
Thermomigration of Liquid Indium and Nickel Thin Film During Bonding Process

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