About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
In-situ Observation of the Ga and Cu/Cu6Ni Reaction by Synchrotron Microradiography |
Author(s) |
Qichao Hao, Xin Fu Tan, Shiqian Liu, Stuart McDonald, Hideyuki Yasuda, Kazuhiro Nogita |
On-Site Speaker (Planned) |
Qichao Hao |
Abstract Scope |
Gallium (Ga) and Ga-based alloys have attracted attention in the microelectronic packaging industry due to their low melting points. However, the intermetallic compounds (IMC) grow slowly between Ga and Cu-based substrates hindering some practical applications of these alloys. The reaction between Ga and Cu-based substrates is essential for understanding the mechanism of the IMCs formation. In this study, the reaction between the liquid Ga and Cu/Cu-6wt%Ni substrates during heating and cooling processes was investigated by in-situ synchrotron 2D imaging. Comparing the in-situ results with the ex-situ experiments, the influence of the heating temperature and cooling process on the IMCs formation was studied, and the IMCs formed during each stage were investigated to identify the properties such as growth speed, morphology, grain sizes, and preferred grain orientation. The growth kinetics of CuGa2 are different during the heating and cooling processes, and this paper provides new insight into the IMC formation mechanisms. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Other, |