| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection
|
| Presentation Title |
C-8: Low-temperature CMOS Compatible SLID & Eutectic Bonding for Wafer Level Packaging |
| Author(s) |
Gürel Dimez, Özgün Yurdakul, Mertcan Sevinç, Oğuzhan Temel, Tayfun Akın, Yunus Kalay |
| On-Site Speaker (Planned) |
Yunus Kalay |
| Abstract Scope |
Wafer-level packaging is crucial for the commercialization of MEMS devices. More than 50% of the production cost is related to packaging when device-level packaging is preferred. CMOS compatibility requires the process temperatures to remain below 450 ℃ while a minimum temperature of 400 ℃ is necessary for Ti getter film activation. In this study, we have investigated the properties of packages after AuSn & AuIn SLID bonded and AlGe eutectic bonded packages that can be used for wafer-level packaging above 400 ℃. In addition to binary systems, we also investigated the performance of AuInSn and CuInSn ternary SLID systems for hermetic packaging. SLID bonded samples yield shear strengths around 35 MPa while AlGe eutectic bonded samples have an average strength of 50 MPa. The Scanning Acoustic Microscopy analysis along with He-leak test results will be compared and discussed in detail. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Joining, Electronic Materials, Thin Films and Interfaces |