About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
The Effects of Sb on the Properties of Hypo-eutectic Sn-Bi Alloys |
Author(s) |
Xin Fu Tan, Qichao Hao, Qinfen Gu, Stuart McDonald, Keith Sweatman, Michael Bermingham, Kazuhiro Nogita |
On-Site Speaker (Planned) |
Kazuhiro Nogita |
Abstract Scope |
The research and development of low temperature solders is motivated by environmental, economic and technical needs. Sn-Bi alloys provide the most promising basis for low temperature soldering materials because of their low liquidus temperatures, low costs and non-toxicity. However, the Bi phase is brittle and Sn-Bi solders tend to have low ductility. While the discovery that addition of Sb can improve the ductility of Sn-Bi alloys has attracted strong commercial interest, there is a lack of understanding of the fundamental mechanisms underlying this effect. This study investigates the effects of Sb on the microstructure, crystal structure and solidification behaviour of hypoeutectic Sn-37wt%Bi-xSb alloys, where x is up to 3 wt%. In-situ heating synchrotron PXRD is used to study the time-temperature dependent crystal structure and phase changes. Calculations of phase diagrams (CALPHAD) and density functional theory (DFT) simulations are used to predict the phases and to calculate the energy of formation. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Characterization, Joining |