About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Mitigation of Tin Whiskers Growth by Co-electroplating Sb |
Author(s) |
Lei Zhang, Xia Wang, Hongwei Qu |
On-Site Speaker (Planned) |
Lei Zhang |
Abstract Scope |
Electroplating Sn coatings are used extensively in electronics industry because of its excellent solderability, ductility, electrical conductivity, and corrosion resistance. However, tin whiskers have been observed to grow spontaneously from the electroplating tin coatings, which can lead to short circuits and devices failures. This problem was solved in the past by adding a few percent of Pb until Pb is banned under ROHS-WEEE restrictions in 2006. In this study, we have developed a state-of-the-art aqueous electroplating bath formulation to deposit a Sn60Sb40 alloy. The alloying of Sn with Sb was observed as effective in suppressing the metallic whisker formations from electroplated Sn-Sb surface finishes under externally applied mechanical stress. The microstructure characterization and the physics behind the whisker mitigation mechanism due to Sb alloying was explored using SEM, EBSD and XRD techniques. |
Proceedings Inclusion? |
Planned: |
Keywords |
Other, Other, |