About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Pad Connectivity Induced Capacitance Effect in Electroless Copper Plating Interconnection |
Author(s) |
Yu Chun Lin, Po-Shao Shih, Jeng-Hau Huang, Simon Johannes Gräfner, Chang-Hsien Shen, C. Robert Kao |
On-Site Speaker (Planned) |
Yu Chun Lin |
Abstract Scope |
Surface defects after ENIG in PCB manufacturing have long been considered to be highly correlated with pad size and pad connectivity. In this research, similar issues are found in chip interconnection using electroless copper plating.
The connectivity between copper pillars and pads triggers skip plating or etching of pillars during electroless copper plating interconnection. Area ratio between pillars and pads exist a threshold value to determine whether electroless plating may take place. An overall mechanism is proposed based on concentration cell induced potential shift.
The result provides a reference standard for chip layout design to avoid defects and improve yield. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Copper / Nickel / Cobalt, Other |