About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Phase-field Simulation of Deposition Profile and Microstructure of Thin Film on Nonplanar Substrate |
Author(s) |
Hwanwook Lee, Ahmad Nadeem, Kiran Raj, Yongwoo Kwon |
On-Site Speaker (Planned) |
Yongwoo Kwon |
Abstract Scope |
Almost all current nano-devices, such as gate-all-around(GAA)-FETs, DRAM, and 3D NAND, require high aspect ratio(HAR). In all these cases, the deposition profile and microstructure of thin films should be well controlled. Polycrystalline structures are difficult to be dealt with atomic-scale simulations due to the large number of atoms and long-time scale. On the other hand, the topological changes of grain boundaries cannot be dealt with by continuum-scale TCAD process simulation. Therefore, a mesoscale simulation, phase-field method (PFM) is the right choice. In this presentation, we will present our development status of phase-field model for a vapor-film-substrate system that can simulate the deposition profile and microstructure on nanostructures, along with nanoscale size effects. |
Proceedings Inclusion? |
Planned: |
Keywords |
Modeling and Simulation, Thin Films and Interfaces, Nanotechnology |