About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Flexible Packaging by Microwave Bonding for Flexible Electronics |
Author(s) |
Tae Ik Lee, Minjeong Sohn, Min-Su Kim, Dongyurl Yu, So Jeong Lee |
On-Site Speaker (Planned) |
Tae Ik Lee |
Abstract Scope |
As research on developing electronic devices for simultaneous implementation of flexibility and conductivity has been continuously conducted, ensuring stable and high reliability of devices against various mechanical deformation is becoming important. When various mechanical forces are applied, the bonding area between substrates should ensure stability due to high stress generation. In this study, a flexible bonding process between polymer substrates was developed by heating carbon nanotubes through microwave irradiation. Carbon nanotubes were coated on a bonded PET polymer substrate, and then local heating was performed by microwaves to induce mechanical entanglement between the CNTs and the PET. For the analysis of the bonding mechanism in the area where mechanical entanglement formed, the CNT-PET bonding interface was analyzed through electron scanning microscope measurement, and further analysis was performed for each process condition. In addition, a fracture mechanism analysis that occurred at the junction was performed after the overlapping shear strength test. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Polymers, Mechanical Properties |