About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Probing Defect Formation and Reliability of Solder Interconnects Produced through Quasi-ambient Bonding |
Author(s) |
Wajira Mirihanage, Saranarayanan Ramachandran, Zhaoxia Zhou, Zhe Cai, Fan Wu, Canyu Liu, Han Jiang, Christoforos Panteli, Stuart Robertson, Andrew Holmes, Sarah Haigh, Changqing Liu |
On-Site Speaker (Planned) |
Wajira Mirihanage |
Abstract Scope |
High-temperature electronics with wide bandgap semiconductors demand reduced bonding time and temperatures to maximise interconnect reliability. Quasi-ambient bonding (QAB) with reactive nanofoils provides instantaneous localised heating right at the bond interfaces and can be a viable solution. Reactive nanofoils are laminated multilayer materials with large negative enthalpy of mixing. The heating occurs as a small burst of energy at fast propagation velocities. However, very limited details are known about the interaction of the reactive nanofoil with solders, solidification and defect formation. High energy synchrotron X-rays were used as a tool to examine the QAB interconnect formation and the reliability. Real time X-radiography images reveal the dynamic nature of the melting and solidification. The defective pore formation was found to correlate with the solidification time and thermal properties. Distributions of residual stress throughout die-attach interconnects were mapped using X-ray diffraction and analysed to understand the bond reliability. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Solidification, Electronic Materials |