About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Investigation of Corrosion for Ni-based Surface Finish |
Author(s) |
Jui-Lin Chao, Si-Wei Lin, Jing-Chie Lin, Yi-Hung Liu, Chih-Yuan Hsiao, Freeze Wang, Nico Li, Alber T Wu |
On-Site Speaker (Planned) |
Jui-Lin Chao |
Abstract Scope |
Electroless, electroplated Ni-based single layer and multilayer Ni/Pd/Au are used as the surface finishing materials deposited on ceramic substrates that can be applied to high-power devices. Electrochemical impedance spectroscopy and polarization curves analysis were adopted to investigate the corrosion behavior. The corrosion potential and current are used to discuss the corrosion mechanism. When the samples were placed in a chamber with various SO2 concentrations, better corrosion resistance was observed for single-layer electroless Ni and multilayer electroplated Ni/Pd/Au compared with that for their well-crystalline electroplated and electroless counterparts, respectively. EBSD results showed that galvanically displaced Pd(P) and immersion Au provided numerous diffusion paths for growing the corrosion products on the electroless Ni/Pd/Au surface than on the electroplated surface due to a high grain boundary density. These results prove that the microstructure and crystallinity of the surface finishing layers have an important effect on corrosion behaviors. |
Proceedings Inclusion? |
Planned: |
Keywords |
Copper / Nickel / Cobalt, Surface Modification and Coatings, |