About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Impact of Non-linear Phase Change Processes on Thermal Impedance of an Electronics Package |
Author(s) |
Patrick Shamberger, Alison Hoe, Juan Carlos Lago, Colton Brietzke, Veronica Gonzalez |
On-Site Speaker (Planned) |
Patrick Shamberger |
Abstract Scope |
Phase change materials (PCMs) can provide thermal buffering to systems that experience transient heat loads, including high power electronics and optoelectronics packaging. However, the impact of high cooling power PCMs on the thermal impedance of an electronics package subject to periodic unsteady heating and convective cooling boundary conditions remains relatively poorly understood. Here, we clarify the interaction between the non-linear phase change process and the linear behavior of heat transfer from an electronics package using both numerical and experimental simulations. In particular, we investigate the impact of PCM thermophysical properties, location in the package, and the specific characteristics of a pulsed heat train. We demonstrate that all of these elements are critical in introducing non-linear thermal buffering into the electronics package. However, when certain criteria are satisfied, introduction of PCMs can provide a powerful tool to regulate temperature rise in cases where the anticipated heat load is well defined. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Energy Conversion and Storage, Phase Transformations |