About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Effects of Different Surface Finish to the Microstructure and Properties of Sn-Ag Solder Joints |
Author(s) |
Mohd Arif Anuar Salleh, Siti Farahnabilah Muhd Amli , Mohd Izrul Izwan Ramli , Mohd Mustafa Al Bakri Abdullah, Mohd Sharizal Abdul Aziz, Hideyuki Yasuda , Jitrin Chaiprapa , Kazuhiro Nogita |
On-Site Speaker (Planned) |
Mohd Arif Anuar Salleh |
Abstract Scope |
The effects of Cu-OSP, ENIG, ImmAg and ImmSn surface finishes to the microstructure and properties of Sn-Ag solder joints were investigated. Besides conventional characterisation methods, in-situ synchrotron X-Ray imaging technique were utilised to analyse and quantify the growth kinetics of microstructure during soldering in the solder joints. High speed shear test were also conducted to understand the correlation of microstructure formation to the solder joint strength. In addition, the growth kinetics of intermetallic compounds (IMCs), morphology and activation energy had been investigated after multiple reflows. Experimental results were then correlated with the numerical finite element (FE) modelling using FE software ANSYS to investigate the effects of primary intermetallics to the reliability of solder joint. It was observed that the formation of (IMCs) were strongly dependent on the types of surface finish applied on Cu substrate which could effect to the properties of the solder joint. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Electronic Materials, |