About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Sintered Ag-In Alloy Paste as Die-attach Material for Power Electronic Packaging |
Author(s) |
Chin-Hao Tsai, Wei-Chen Huang, C. R. Kao |
On-Site Speaker (Planned) |
Chin-Hao Tsai |
Abstract Scope |
With the rising utilization of electric vehicles, power electronic packaging becomes important in the next decade. It’s necessary to develop reliable die-attach materials which can withstand high temperatures generated due to high-power applications. Ag pastes attract much attention in recent years because Ag pastes sintering has the merits of low processing temperature and high melting temperature after sintering. However, sintered Ag joints encounter unavoidable reliability issues, such as sintered pores coarsening and oxidation problems. The addition of indium (In) has proved to significantly improve the reliability of sintered Ag joints. However, current methods for introducing In are not fully compatible with large-scale industrial manufacturing. Therefore, this research develops novel Ag-In alloy pastes by ball milling for die-attach applications. The results demonstrate the Ag-In alloy joints exhibit excellent shear strength up to 80 MPa. In addition, the Ag-In alloy joints show more outstanding mechanical reliability than Ag joints in high-temperature surroundings. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Powder Materials, Mechanical Properties |