About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Influences of Deposition Speed on Void Formation in Electroless Copper Plating Film for Micro-vias |
Author(s) |
Ming Chun Hsieh, Zheng Zhang, Masahiko Nishijima, Chuantong Chen, Katsuaki Suganuma, Hidekazu Honma, Yu Shimizu, Koji Kita, Joonhaeng Kang, Takashi Matsunami, Kuniaki Otsuka |
On-Site Speaker (Planned) |
Ming Chun Hsieh |
Abstract Scope |
Micro-via, that connects electrical components to each other, is essential in electrical devices. However, together with the decrease in its size, which has become one-tenth to what it was in late 20th century, nowadays micro-via faces quality problems as delamination and cracks, and “weak micro-via” issue raises high concerns. One of the reasons that causes weak micro-via problem is formation of nano- to micro-sized voids in electroless plating layer in micro-via structure. However, mechanism of void formation is not sufficiently studied yet. In order to identify the reason(s) that is related to void formation, we investigated the influence of Cu deposition speed on void formation in electroless Cu plating layer for micro-vias by adjust deposition speed to 3 different rates. Electroless plating Cu layer deposited with the 3 different deposition speeds are observed by FE-SEM and TEM and their morphological and numerical differences of voids will be discussed. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Copper / Nickel / Cobalt, Process Technology |