About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Characterising the Thermal Expansion Behaviour in In-Sn Superconducting Solder Joints by In-situ Synchrotron Powder X-ray Diffraction |
Author(s) |
Jiye Zhou, Xin Fu Tan, Qinfen Gu, Stuart McDonald, Kazuhiro Nogita |
On-Site Speaker (Planned) |
Jiye Zhou |
Abstract Scope |
Indium based solder alloys are regarded as potential candidates for the next generation of low temperature solder materials, especially for superconducting joints. In this research, the temperature dependent thermal expansion behaviour of two different solder compositions including In-35Sn and In-25.6Sn has been studied using an in-situ synchrotron powder X-ray diffraction (PXRD) method. The variation in lattice parameters in the superconducting phase – β-In3Sn and the Sn-rich phase – γ-InSn4 in the temperature range from 30 °C to 150 °C was characterised. Results revealed that the c-axis of the β-In3Sn unit cell in the In-35Sn alloy exhibited a “smile” parabolic trend as the temperature increases compared to the positive linear trend in In-25.6Sn. The observations are discussed with respect to the equilibrium phase diagram and the proportions and composition of both the γ-InSn4 and β-In3Sn phases present within the alloys. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Phase Transformations, Characterization |