About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
New Insights into the Nucleation and Growth of Ag3Sn Plates in Solder Joints |
Author(s) |
Christopher M. Gourlay, Yi Cui, Athanasios Zois |
On-Site Speaker (Planned) |
Christopher M. Gourlay |
Abstract Scope |
The nucleation and growth of Ag3Sn is studied in 500um balls of Sn-Ag and Sn-Ag-Cu solders cooled in a differential scanning calorimeter (DSC) with and without copper substrates. The droplets undercooled to 1 - 50 K with respect to the Ag3Sn liquidus, enabling a study of Ag3Sn crystal morphology versus undercooling. It is found that the Cu6Sn5 reaction layer has a strong influence on the nucleation of Ag3Sn, and consequently also on its growth. The results provide new insights that allow us to understand the wide range of Ag3Sn morphologies in solder joints. |
Proceedings Inclusion? |
Planned: |
Keywords |
Solidification, Electronic Materials, |