About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Effects of Diameter on Copper Pillar with Solder Cap Interconnections during Reflow Soldering Process |
Author(s) |
Lee Jing Rou, Mohd Sharizal bin Abdul Aziz, Mohd Arif Anuar Mohd Salleh, Khor Chu Yee, Mohammad Hafifi Hafiz Bin Ishak |
On-Site Speaker (Planned) |
Mohd Sharizal bin Abdul Aziz |
Abstract Scope |
Recently, the copper pillar with solder cap interconnection has been introduced as an alternative for the solder bump interconnection in order to tackle the limitations, such as the collapsing nature of the solder bump and larger pitch size. This paper presents an effective simulation tool to evaluate the effects of different diameters of the copper pillar with solder cap during the reflow soldering process. A three-dimensional numerical approach is used to investigate the thermal behaviour of the copper pillar with solder cap with different diameters. The interconnection bump diameters are 150, 200, 250, 300 and 350μm. The model is developed and meshed using the Computational Fluid Dynamics (CFD) software. The temperature distributions of the copper pillar with solder cap with different diameters are predicted. The paper aims to provide an understanding of the effect of diameters on the temperature distribution of copper pillars with solder cap during reflow soldering. |
Proceedings Inclusion? |
Planned: |
Keywords |
Modeling and Simulation, Copper / Nickel / Cobalt, Joining |