About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Low Melting Temperature Solder Interconnect Thermo-mechanical Performance Enhancement Using Elemental Tuning |
Author(s) |
Tae-Kyu Lee, Nilesh Badwe, Greg Baty, Raiyo Aspandiar, Young-Woo Lee |
On-Site Speaker (Planned) |
Tae-Kyu Lee |
Abstract Scope |
Recent studies on Sn-Bi based low melting temperature solder interconnect with minor elemental tuning show relatively good thermal cycling performances compared to conventional Sn-Ag-Cu based solder interconnects at a given thermal cycling profile. The degradation mechanism is related to twin boundary formation, a different mechanism compared to general Sn-Ag-Cu solder interconnects. An attempt to slow down the degradation rate is implemented with adding Indium into the eutectic Sn-Bi based alloy system. Along with the thermal cycling performance enhancement, the mechanical shock performance is also investigated. In this study, 12x12 mm chip array BGA (CABGA) components on 62mil think boards were thermal cycled with -40 to 100oC profile and 10min dwell for thermal cycling and 1500G was applied for mechanical shock. The correlation between crack initiation, crack propagation, sub-grain development and localized recrystallization were compared using polarized imaging and Electron–backscattered diffraction (EBSD) imaging. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Phase Transformations, Mechanical Properties |