About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
No-Flow Electroless Connections for Die-to-Wafer Attach |
Author(s) |
Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Chang-Hsien Shen, Yu-Chun Lin, Po-Yu Kung, C. Robert Kao |
On-Site Speaker (Planned) |
Jeng-Hau Huang |
Abstract Scope |
Hybrid bonding is considered the most promising technology to realize high interconnection density in 3D packaging. Nevertheless, some challenges such as high temperature and extremely low surface roughness need to be concerned. To solve the following problems, a novel, simple 3D packaging process is developed. Adding a small amount of the high copper concentration electroless Cu plating solution, high uniformity electroless interconnections are achieved in several minutes with very low temperature and no pressure. This process has great potential to apply to micro and nanoscale technology. Owing to its simplicity, it can be expected to use in the wafer-to-wafer level package in the future. |
Proceedings Inclusion? |
Planned: |
Keywords |
Process Technology, Copper / Nickel / Cobalt, Other |