About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
The Effect of Ni Microalloying on the Microstructure Evolution of In-35wt.% Sn Solder Alloy |
Author(s) |
May Shin Chang, Mohd Arif Anuar Mohd Salleh, Dewi Suriyani Che Halin, Hideyuki Yasuda, Tetsuro Nishimura, Kazuhiro Nogita |
On-Site Speaker (Planned) |
May Shin Chang |
Abstract Scope |
In-35wt.% Sn alloy is a potential Pb-free solder alloy for low temperature electronic packaging interconnect of quantum computing due to the superconductive properties. Such properties are highly dependent on the properties of the β-phase. This paper studies the effect of Ni microalloying on the microstructural changes of β-phase in an In-35wt.% Sn alloy during the solidification process by using the in-situ real-time synchrotron radiography technique. The β-phase preferably formed a columnar dendritic structure that made a transition to cellular-dendrite structure with a unique morphology after addition of 0.05wt% Ni into the In-35wt.% Sn alloy. The findings provide detailed observations of microstructure evolution, specifically β-In3Sn phase, and examine the effects of Ni addition during solidification of the In-35wt.% Sn alloy. The results are of relevance to the development of superconductive Pb-free solder alloys for electronic applications at extreme low temperature. |
Proceedings Inclusion? |
Planned: |
Keywords |
Solidification, Electronic Materials, Joining |