About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Study of Sn-Bi-In Ternary Solders with Compositions of Lines between Binary Eutectic Points to Ternary Eutectic Points |
Author(s) |
Hoon Choi, Hoo-Jeong Lee |
On-Site Speaker (Planned) |
Hoon Choi |
Abstract Scope |
In this study, Sn-Bi-In ternary solder for low melting temperature solder is systematically examined. The compositions are selected at two lines from eutectic points of Sn-Bi and that of Sn-In to two ternary eutectic points (56°C and 79°C). For systematic investigation, we performed CALPHAD simulation to obtain phase diagram and thermal information such as pasty zone (liquidus temperature (Tliquidus) – solidus temperature (Tsolidus)). DSC results indicate that several endothermic peaks roughly correspond to the prediction of the phase diagram. Solder balling test shows consistent trends with change of pasty zone predicted by CALPHAD simulation. Microstructures and the intermetallic compounds were examined by scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS). Shear test and fracture surface analysis disclose the trends of mechanical properties by phase fraction change. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Phase Transformations, Solidification |