About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Low Temperature Direct Bonding in Atmosphere by Nanocrystalline Ag |
Author(s) |
Cheng Jie Yang, Fan-Yi OuYang |
On-Site Speaker (Planned) |
Cheng Jie Yang |
Abstract Scope |
In recent years, Moore's law is approaching physical limit. Using metal-to-metal direct bonding to develop 3D integrated circuits is an effective way to scale and improve performance of devices. In this study, we performed Ag-to-Ag direct bonding in atmosphere using nanocrystalline Ag thin films and bumps. With the help of nanocrystalline grains, we successfully developed the low temperature metal to metal bonding process at 185 ℃ for 5 minutes by thermo-compressive bonding under the pressure of 5 MPa. The results of shear test show the bonding strength could reach 67.6 MPa. The average resistance of Ag microbump in a diameter of 40 μm was 1.84mΩ and the average specific contact resistance was 2.9 × 10-8 Ω. The corresponding bonding mechanism and reliability will be discussed in this talk. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Thin Films and Interfaces, Nanotechnology |