About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Surface Precipitation and Growth of Bismuth Particles in Sn-Bi Solder Alloys |
Author(s) |
John Wu, Amey Luktuke, Nikhilesh Chawla |
On-Site Speaker (Planned) |
John Wu |
Abstract Scope |
Bismuth is commonly used as an allowing addition to Pb to lower the solder alloy’s melting temperature and improve the joint strength. Our previous work on SAC has shown that, with small concentrations of Bi, precipitation is driven by a surface diffusion, and the bismuth particles will gather at the exposed surface. We have continued this work on binary Sn-Bi. In this talk we report on a systematic observation of surface precipitation in Sn-3Bi and Sn-7Bi solder alloys. Time-resolved imaging, using scanning electron microscopy was conducted. The precipitation rate was calculated. Correlation of bismuth precipitation to the grain boundaries misorientation angle was conducted and will be discussed. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Characterization, |