About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Effect of Joint Length Scale on Creep Deformation of Sn-rich Dissimilar Metallic Joints |
Author(s) |
Praveen Kumar, Anwesha Kanjilal |
On-Site Speaker (Planned) |
Praveen Kumar |
Abstract Scope |
This study analyzes the joint-scale effect on creep and failure of Sn-rich dissimilar joints. Sn-Cu and Sn-Ag-Cu(SAC)/Cu joints of varied thicknesses were fabricated and creep tested in tension. In both systems, at given stress, the secondary creep rate reduced with a reduction in joint thickness, and crystallographic texture varied with length scale. In thinner joints, creep rate and strain during tertiary decreased, with transition in failure from necking to cavitation. The synergistic approach of continuum-based finite element analysis and microstructure-based crystal plasticity modeling captured the dimensional and microstructural constraints on size-dependent reduction of creep rate. At the same time, necking-cum-cavitation-based model explained the role of joint size-dependent stress state and varying length of neck on tertiary creep. The effect of electric current and precipitates as well as the interfacial intermetallic compounds on the size-dependent creep of joints were also analyzed and correlated with the aforementioned behavior. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Mechanical Properties, Characterization |