About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
On the Thermal Aging of the Nanoporous Structure of Sintered Ag on a Cu Substrate |
Author(s) |
Xavier Milhet, Jerome Colin, Azdine Nait-Ali, Kokouvi N'Tsouaglo, Loic Signor |
On-Site Speaker (Planned) |
Xavier Milhet |
Abstract Scope |
As power modules are a complex assembly of different materials a fine evaluation of the evolution of the materials and interfaces is necessary during aging. In this work, time resolved evolution (4D) of the nanoporous microstructure of sintered Ag (s-Ag) and sintered Ag on Cu (s-Ag/Cu) during thermal aging was monitored at high temperature using in-situ X-ray nanotomography. For both types of specimen, the density remains constant, the evolution is driven by the bigger pores and the pore growth follows the Ostwald ripening mechanism leading to a decrease of the smaller pore number. Faster kinetics of growth is observed for s-Ag/Cu before deviating from Ostwald ripening after a critical time. Furthermore, complex evolutions in small pores clusters can be observed in both type of specimens. Those behaviors are discussed based on diffusion mechanisms in relation with a competition between local stresses relaxation and surface energy during diffusion. |
Proceedings Inclusion? |
Planned: |
Keywords |
Characterization, Electronic Materials, Other |