About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Power Cycling Reliability with Temperature Deviation of Pressureless Silver Sinter Joint for Silicon Carbide Power Module |
Author(s) |
Won Sik Hong, Mi Song Kim |
On-Site Speaker (Planned) |
Won Sik Hong |
Abstract Scope |
We developed silver (Ag) sintered power module with no pressure for electric vehicle. Silicon carbide (SiC) MOSFET device was sintered on Ag finish silicon nitride (Si3N4) active metal brazed (AMB) ceramic substrate with Ag paste under 240 ℃, 75 min in vacuum and nitrogen gas atmosphere. To verify the sinter joint reliability, we conducted 2 kinds of power cycling tests (50-100 ℃ (△Tc=50℃) and 50-150 ℃ (△Tc=100℃), 3000 cycles), and then, on resistance and switching efficiency of the power module were compared. Based on these results, we confirmed the reliability and electrical performance of the Ag sintered power module. |
Proceedings Inclusion? |
Planned: |
Keywords |
Joining, Characterization, Process Technology |