About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Microalloying Effects of Sb and Ag on the Strain-Rate Sensitivity and Microstructural Evolution of Eutectic SnBi Alloys |
Author(s) |
Hannah Fowler, Sukshitha Achar Puttur Lakshminarayana, Sui Xiong Tay, Ganesh Subbarayan, John Blendell, Carol A Handwerker |
On-Site Speaker (Planned) |
Hannah Fowler |
Abstract Scope |
Eutectic SnBi solders are reflowed at 180°C, and this limits the heating-induced warpage that occurs during the higher temperature reflow of 240°C required for Sn-Ag-Cu (SAC) solder alloys. In contrast to SAC alloys, however, eutectic SnBi solders are more strain-rate dependent. SnBi performs well during thermal cycling at low strain-rates but performs poorly during the high strain-rates in drop-shock reliability testing. The literature reports that small alloying additions of Sb and Ag can improve drop-shock reliability by increasing the ductility of SnBi alloys and reducing strain-rate sensitivity, without reducing strength. In this presentation, we will report on how different levels of Sb alloying impacts the mechanical properties and microstructural evolution of both eutectic SnBi and eutectic SnBi-1Ag solder alloys on Cu and ENIG (electroless nickel immersion-gold) substrates. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Mechanical Properties, Other |