About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Current-enhanced Presureless Sintering of Cu Nanoparticles at Room Temperature |
Author(s) |
Tzu-Hao Shen, Albert T. Wu |
On-Site Speaker (Planned) |
Tzu-Hao Shen |
Abstract Scope |
Low-temperature sintering of Cu nanoparticles is an attractive approach to realize joint in devices for high-temperature applications. This study presents a low current-enhanced sintering method for Cu nanoparticles without applying pressure at low temperature. Commercial Cu nanoparticles with an average diameter of 300 nm were mixed with polyethylene glycol (PEG) as Cu paste, which was then filled in V-grooves on Si substrate. After pre-sintered the Cu paste at low temperature, a low current density was applied to further densified the Cu nanoparticles. The effect of the current on the sintering of Cu nanoparticles was investigated. Mathematical models are proposed to discuss the kinetics of growth of the particle necks. The model suggested that along with the curvature-driven ripening, current crowding contribute an additional driving force for sintering. |
Proceedings Inclusion? |
Planned: |
Keywords |
Other, High-Temperature Materials |