About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Ball Drift in SnAgCu/SnBi Hydrid Joints during Thermal Cycling |
Author(s) |
Jingwei Xian, R.J. Coyle, L. Wentlent, J. Wilcox, Christopher M. Gourlay |
On-Site Speaker (Planned) |
Jingwei Xian |
Abstract Scope |
There is an ongoing desire to reduce the solder processing temperature to reduce cost and emissions while minimising dynamic warpage. One approach is to use hybrid joints that combine high temperature solder balls with a low temperature solder paste in two-step reflow. During thermal cycling of SnAgCu/SnBi hybrid joints it has been found that some joints are sheared significantly out of position, a phenomenon termed ball drift. In this presentation, we will quantify the ball drift phenomenon, measure the microstructure evolution that occurs during drift, investigate the mechanisms that cause the pronounced shear, and explore how crystallographic orientation affects ball drift. |
Proceedings Inclusion? |
Planned: |