About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
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Electronic Packaging and Interconnection
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Presentation Title |
Network Structure and Viscoelasticity of Flexible Electronic Interconnects based on Linear Low-density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites |
Author(s) |
Khairul Anwar Abdul Halim, Mohd Arif Anuar Mohd Salleh, Mohd. Firdaus Omar, Azlin Fazlina Osman, Muhammad Salihin Zakaria |
On-Site Speaker (Planned) |
Khairul Anwar Abdul Halim |
Abstract Scope |
Flexible conductive polymer composites (CPCs) had become area of interest as electronic interconnect. The ability of a polymer matrix to conduct electric depends upon the conductive filler concentrations and formation of network path. Furthermore, interconnects are deemed to have the ability to maintain high conductivity whilst flexible following the movement of the electronic device at various operating temperature and conditions. The main aim of this research works was to establish and understand the correlation between the network structure and viscoelastic properties of a linear low-density polyethylene (LLDPE) and liquid silicone rubber (LSR) compounded with various conductive fillers. The resulting CPC samples were characterized and tested using various techniques such as synchrotron micro-X-Ray Fluorescence (XRF) technique, electron microscopy, dynamic mechanical analysis, thermal studies, 4-point probe, and tensile testing. The data obtained revealed the potential of utilizing CPCs as flexible interconnects suitable for advance electronic applications. |
Proceedings Inclusion? |
Planned: |