| About this Abstract |
| Meeting |
2023 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection
|
| Presentation Title |
Microstructural Effect of Cu Substrate on Join Properties for Cu-to-Cu Direct Bonding |
| Author(s) |
Hung Wang, Albert T. Wu |
| On-Site Speaker (Planned) |
Hung Wang |
| Abstract Scope |
Cu nanoparticle paste has the possibility to become a joint that can be sintered at low temperature. It has the potential to be applied in high power device packaging owing to its outstanding electrical conductivity and mechanical properties. Although numerous approaches have been proposed for sintering the Cu nanoparticle, there are not many studies on microstructural relationship between the Cu substrate and the sintered Cu joint. In this study, Cu layers are electroplated on Cu substrates by adjusting the current density. The electroplating Cu is annealed at various temperature for observing the evolution of grain size and the relaxation of residual stress. To further understand the microstructural effect on the joining properties, the electroplating Cu substrates are bonded by Cu nanoparticle paste. The shear strength of the joints is measured and evaluated. A model that includes the calculation of chemical potential of Cu nanoparticles and the substrates is proposed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Powder Materials, Copper / Nickel / Cobalt |