About this Abstract |
Meeting |
2023 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnection
|
Presentation Title |
Properties of Sn-3wt%Ag-5wt%Cu Alloys with Cu6Sn5 Intermetallic Grain Refined by Mg |
Author(s) |
Chiying Tan, Mohd Arif Anuar Mohd Salleh, Xin Fu Tan, Hideyuki Yasuda, Norainiza Saud, Tetsuro Nishimura, Kazuhiro Nogita |
On-Site Speaker (Planned) |
Chiying Tan |
Abstract Scope |
The influence of Mg addition was investigated on the microstructure, thermal, electrical properties and joint strength of bulk and ball grid array (BGA) reflowed Sn-3wt%Ag-5wt%Cu solder alloy. The addition of Mg effectively triggered the grain refinement of primary Cu6Sn5 IMCs in the bulk solder alloys. In addition, the thickness of the interfacial Cu6Sn5 IMCs layer was suppressed. Synchrotron tomography images reveal that the grain refinement of primary Cu6Sn5 IMCs is also effective even in BGA scale solder joint at normal reflow conditions. These primary Cu6Sn5 IMCs showed a non-faceted morphology. 0.10wt%Mg addition reduced the number and size of the Cu6Sn5 IMCs. The undercooling values was significantly reduced to the minimum with 0.10wt%Mg addition, which increased when the amount of Mg increased to 0.15wt%. The mechanical properties showed that the ductility of the solder joint at high shear speed was improved. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Magnesium, Other |