About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Nucleation and Growth Kinetics of Sn Whiskers Under Applied Pressure |
Author(s) |
Eric Chason, Piyush Jagtap, Nupur Jain, Allan Bower |
On-Site Speaker (Planned) |
Eric Chason |
Abstract Scope |
Sn whiskers grow spontaneously out of coatings on electronic components and pose risks for system failure. Numerous studies suggest that whisker growth is driven by stress in the film, yet many aspects of their nucleation and growth are still not understood. This can be attributed, in part, to the fact that the stress is difficult to characterize or control. We have performed experiments using an apparatus that applies controlled pressure to a region of the film’s surface. This apparatus was designed to be small enough to fit into a scanning electron microscope so that the resulting whiskers could be monitored periodically without removing the applied pressure. This enabled the number density and growth rate of individual whiskers to be measured in real-time. A finite element analysis model is used to relate the stress to the observed nucleation and growth kinetics. |
Proceedings Inclusion? |
Planned: |