About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Modeling and Simulation of Stress Gradient Driven Migration |
Author(s) |
Zachary J. Morgan, Yongmei Jin, Vahid Attari, Raymundo Arroyave |
On-Site Speaker (Planned) |
Zachary J. Morgan |
Abstract Scope |
Stress gradients influence the migration velocity and path of defects such as voids and precipitates in solder interconnects. As physical size is reduced, the role of stress and its gradient on reliability become unclear due to the wide range of properties present in solder microstructures. In particular, anisotropy plays an increasingly important role in migration and deformation behavior. A phase field model is developed using microelasticity modeling to investigate the influence of stress concentrations on void and precipitate migration that accounts for driving forces for diffusion. Simulations reveal the influence of different loading conditions on defect migration and contribution of local variations in stress that give rise to internal stress gradients. Examples discussed include stress gradients caused by external loading and internal stress concentrations due to elastic property mismatches near grain boundaries, voids, and precipitates. These findings offer insight into the role of microstructure and stress on solder interconnect performance. |
Proceedings Inclusion? |
Planned: |
Keywords |
Modeling and Simulation, |