About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Low-Temperature and Pressureless Cu-to-Cu Bonding by Electroless Pd Plating Using Microfluidic System |
Author(s) |
Po Shao Shih, Zhen De Ma, Han Tang Hung, Jeng Hau Huang, C.Robert Kao |
On-Site Speaker (Planned) |
Po Shao Shih |
Abstract Scope |
Fulfilling the packaging trend of getting lighter weight and possessing multi-functional modulus simultaneously, 3D-IC technology has implemented of finer pitch and higher interconnect density over the past decades. Thermocompression bonding, which is a promising technique for high-density integration and has been applied widely among industries, might not be the best choice for devices which cannot withstand the high temperature and pressure during the bonding process. To overcome this challenge, a novel Cu-to-Cu bonding process using electroless Palladium plating in an airtight microfluidic system around 70℃ was investigated. This method provides a low temperature and pressureless operating environment and full-metal interconnections after bonding. The bonded pillars were analyzed by scanning electron microscope. In addition, the cross-section images and the plating condition were further confirmed and investigated by focused ion beam and electron probe micro-analyzer. This innovative method might be a potential candidate for future low stress and low thermal budget bonding. |
Proceedings Inclusion? |
Planned: |