| About this Abstract |
| Meeting |
2021 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnections 2021
|
| Presentation Title |
On the 3D Evolution of the Nanoporous Structure of Sintered Ag on a Cu Substrate During Isothermal Aging Observed by In-situ X-ray NanoTomography |
| Author(s) |
Kokouvi N'Tsouaglo, Azdine Nait-Ali, Mikael Gueguen, Pascal Gadaud, Loic Signor, Juan Creus, Marc Legros, Yijin Liu, Xavier Milhet |
| On-Site Speaker (Planned) |
Kokouvi N'Tsouaglo |
| Abstract Scope |
The most advanced power modules are developped around SiC or GaN chips, allowing better performance at the expense of higher operating temperature. The reliabilty of those modules depends on both the numerous materials and interfaces composing their complex architecture. Indeed, each of these materials have different thermal mismatch coefficients, mechanical and thermal properties, microstructure evolution and all of which influence the adhesion at the interfaces. In particular, the evolution of the microstructure of sintered silver joint (S-Ag), used as bonding material, is one of the key parameter for the sustainability and the performance of the modules. In this context, the pore struture of S-Ag specimens during isothermal aging in the range 200°C to 350°C were monitored in 3D using in-situ transmission X-ray imaging (BL 6.2C at SLAC SSRL, USA). Drastic evolution differences were observed between pure S-Ag and S-Ag specimens containing an interface with a Cu substrate. |
| Proceedings Inclusion? |
Planned: |