About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Development of Near Room Temperature Solder Alloys and Soldering Processes in Microelectronics |
Author(s) |
Shiqian Liu, Stuart McDonald, Tetsuro Nishimura, Kazuhiro Nogita |
On-Site Speaker (Planned) |
Shiqian Liu |
Abstract Scope |
New and emerging applications involving temperature-sensitive or flexible electronics have created a need for low process temperatures during electronics assembly. Ga and some of its alloys have a range of properties that offer the possibility of near room temperature soldering processes. This study develops a fundamental and comprehensive understanding of interfacial reactions between Ga and Cu-Ni substrates at near room temperature. Microstructure development and key properties of the interfacial intermetallics were investigated. These results are reported in the context of recent advances in the understanding of solder alloys and intermetallics and builds on current knowledge in the broader field of metal joining. A case is made for the commercial applications of non-toxic Ga and Ga-based alloys for joining materials in electronics manufacturing. |
Proceedings Inclusion? |
Planned: |