About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Single Solder Joint Shear with In-situ Current Stressing |
Author(s) |
Kendra Young, Choong-Un Kim, Tae-Kyu Lee |
On-Site Speaker (Planned) |
Tae-Kyu Lee |
Abstract Scope |
Single solder joint shear tests were performed on Sn based solder joints with in-situ current stressing in variations of current density per solder joint. In order to investigate the current effect, the tests were design to decouple the Joule heating from current flow effect. Subsequent shear tests were performed in the absence of applied current at a range of -40oC to 100oC steady-state temperature holding condition to mimic the temperature variables induced by current stressing. Decoupled temperature effects from current reveal that the shear load decreased through elevated temperature shearing relative to their respective induced current test and demonstrate an increase in maximum shear load on the isothermally aged 700A/cm2 current density condition. Certain current density stressing caused an instantaneous thermal gradient and an inhomogeneous temperature distribution in the solder ball, which ultimately differed the shear response with in-situ current shearing. |
Proceedings Inclusion? |
Planned: |