About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Effects of Antimony on the Microstructure and Reliability of Sn-Ag-Cu-based Solder Joints |
Author(s) |
Sergey Belyakov, Richard J. Coyle, Babak Arfaei, Christopher M. Gourlay |
On-Site Speaker (Planned) |
Christopher M. Gourlay |
Abstract Scope |
Antimony is increasingly being added to Pb-free solders to improve thermal cycling performance in harsher conditions. Here, we investigate microstructure evolution and failure in harsh accelerated thermal cycling (ATC) of a Sn-3.8Ag-0.9Cu solder with 5.5 wt% antimony as the major addition in two ball grid array (BGA) packages. Similar to Sn-Ag-Cu solders, microstructure and damage evolution were generally localised in the beta-Sn near the component side where localised beta-Sn misorientations and subgrains, accelerated SbSn and Ag3Sn particle coarsening, and beta-Sn recrystallisation occurred. Cracks grew along the network of recrystallised grain boundaries to failure. The improved ATC performance is mostly attributed to SbSn solid state precipitation within beta-Sn dendrites which supplements the Ag3Sn that formed in a eutectic reaction between beta-Sn dendrites, providing populations of strengthening particles in both the dendritic and eutectic beta-Sn. |
Proceedings Inclusion? |
Planned: |