About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Effect of Annealing on Mechanical Properties of nt-Cu Lines in Fan-out Wafer Level Packaging |
Author(s) |
Wei-You Hsu, Yu-Jin Li, I-Hsin Tseng, Benson Tzu-Hung Lin, Chia-Cheng Chang, Chih Chen |
On-Site Speaker (Planned) |
Wei-You Hsu |
Abstract Scope |
In this study, we annealed nanotwinned Cu (nt-Cu) and regular Cu lines at different temperatures to examine their toughness. The results show the toughness of as-fabricated nt-Cu lines is at least 33.6MJ/m3, and its tensile strength is 833 MPa. However the toughness of asfabricated regular Cu is only 12 MJ/m3. And after annealing at 250°C for 3h, the toughness of nt-Cu increased into 65 MJ/m3, and the tensile strength is 600 MPa. In contrast, the toughness of regular Cu lines becomes 13 MJ/m3. In addition, we annealed the both Cu lines at 150°C and 200°C for 3h and we observed the toughness of nt-Cu lines is better than that of regular Cu lines regardless of annealing conditions. Finally, the toughness of nt-Cu can increase after different annealing conditions, which make nt-Cu to be a promising material as redistribution lines for next generation fan-out wafer-level packaging. |
Proceedings Inclusion? |
Planned: |