About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Reducing Cracking in BGA Solder Joint Cu6Sn5 by Controlling the Reflow Profile |
Author(s) |
Kazuhiro Nogita, Flora Somidin, Keith Sweatman, Tetsuya Akaiwa, Tetsuro Nishimura, Syo Matsumura, Xiaozhou Ye, Stuart D. McDonald |
On-Site Speaker (Planned) |
Kazuhiro Nogita |
Abstract Scope |
The polymorphic transformation that occurs in the Cu6Sn5 intermetallic compound at 186°C has the potential to generate stresses that could lead to cracking of that phase in soldered joints. This cracking may occur during the multiple reflow cycles of a typical printed board assembly process or during the thermal cycles to which electronic assemblies are exposed during service. In this paper the authors report a method of reducing cracking in interfacial Cu6Sn5 in solder joints made with solder alloys Sn-3.0Ag-0.5Cu, Sn-0.7Cu-0.05Ni-1.5Bi, and Sn-37Pb to Cu-OSP substrates by controlling the cooling stage of the reflow profile. It was found that modified reflow profiles reduced cracking in the interfacial Cu6Sn5 layer and this resulted in improved resistance of the reflowed solder ball to failure in high speed impact shear testing. |
Proceedings Inclusion? |
Planned: |