About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Reliability Evaluation of Ag Sinter-joining Die Attach under a Harsh Thermal Cycling Test |
Author(s) |
Zheng Zhang, Chuantong Chen, Suetake Aiji, Ming-Chun Hsieh, Iwaki Aya, Katsuaki Suganuma |
On-Site Speaker (Planned) |
Zheng Zhang |
Abstract Scope |
Ag sinter joining is an ideal connection technique for next-generation power electronics packaging due to its excellent high-temperature stability. In this work, we applied Ag sinter joining to die attach of power electronics and focused reliability of Ag sinter joining under a harsh thermal cycling condition. The thermal cycling test was conducted at a temperature range from -50 °C to 250 °C. The bonding quality of as-sintered die attach had a shear strength of over 40 MPa and remained over 25 MPa after a 500-cycle test. However, the shear strength drastically degraded to less than 10 MPa due to a failure of metallization layer detachment after 500 cycles. Meanwhile, thermal resistance changes of die attach during the thermal cycling test were also evaluated by a T3ster. The investigation suggests that the Ag sinter joining is capable of withstanding a severe operating condition of power electronics. |
Proceedings Inclusion? |
Planned: |