About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Microstructural Evolution in Low-temperature Pb-free Solders |
Author(s) |
Nikhilesh Chawla |
On-Site Speaker (Planned) |
Nikhilesh Chawla |
Abstract Scope |
With the increasing miniaturization and shift to heterogeneous integration in electronic packaging, a lot of attention is being paid to lower temperature solder alloys. In this talk, we discuss the microstructure evolution of Sn-Bi and Sn-In low temperature solder alloys. The evolution of the bulk solder microstructure as well as the Cu6Sn5 intermetallic layer during thermal aging and electromigration was studied. Coarsening of the microstructures was studied by correlative microscopy techniques, including x-ray micro and nanotomography, EBSD, and scanning electron microscopy. Mechanisms for coarsening, microstructure evolution, and their effect on electrical and mechanical properties were elucidated and will be discussed. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Characterization, Other |