About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Influence of Indium on the Microstructure and Properties of Interfacial IMC in Sn-rich Solder Joints: Experiments and First Principle Calculations |
Author(s) |
Amey Luktuke, Arun Sundar, Nikhilesh Chawla |
On-Site Speaker (Planned) |
Amey Luktuke |
Abstract Scope |
The composition of the interfacial intermetallic (IMC) layer (Cu6Sn5) in Sn-rich solder joints plays a critical role in determining mechanical properties, layer stability during thermal aging, and the damage due to electromigration stressing. Alloying of Indium gives rise to the substitution of Sn atoms by In atoms forming the IMC layer of Cu6(Sn,In)5. However, the effects of such a compositional change on mechanical properties, thermal aging, and electromigration behavior are not well understood. Microstructural and mechanical properties of the interfacial IMC were investigated, with solder composition ranging from Sn-2-10 wt% In. Using WDS precise compositional analysis of IMC layer was carried out. SEM and EBSD were used for microstructural characterization of IMC. To obtain the mechanical properties, nanoindentation analysis was performed. Effect of In substitution on the modulus of Cu6Sn5 was also analyzed by performing first principle calculations. The correlation between experiment and calculations was established and will be discussed. |
Proceedings Inclusion? |
Planned: |
Keywords |
Electronic Materials, Mechanical Properties, Computational Materials Science & Engineering |