About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Real-time Observation of the Accelerated Growth of (Cu,Ni)6Sn5 on Cu-xNi |
Author(s) |
Xin Fu Tan, Sergey Belyakov, Te-Cheng Su, Stuart McDonald, Christopher Gourlay, Hideyuki Yasuda, Syo Matsumura, Kazuhiro Nogita |
On-Site Speaker (Planned) |
Xin Fu Tan |
Abstract Scope |
The time required to form a bond by transient liquid phase soldering (TLPS) with a mix of Sn and Cu is determined by the rate at which the Cu reacts with the Sn to form a coherent matrix of Cu6Sn5 intermetallic compound (IMC). The growth rate of the IMC is greatly accelerated if, instead of pure Cu, a Cu-xNi alloy is used, making possible formation by TLPS of a bond stable at high temperatures in a time comparable with that of conventional reflow soldering. The (Cu,Ni)6Sn5 formed has the additional benefit of resistance to the polymorphic transformation and Cu3Sn formation is suppressed. The dynamics of the accelerated growth were studied by real-time observation of the formation of (Cu,Ni)6Sn5 between Cu-xNi alloys and liquid Sn using Synchrotron X-ray imaging. A range of electron microscopy techniques were used to reveal the mechanisms of the accelerated growth. |
Proceedings Inclusion? |
Planned: |