About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Sn-Ag-Cu and Sn-Bi Solder Powders for Fine Pitch Printing |
Author(s) |
Amir Nobari, Arslane Bouchemit, Gilles L’Espérance |
On-Site Speaker (Planned) |
Amir Nobari |
Abstract Scope |
The continuing demand for smaller electronic products has driven the use of miniature components. The assembly of these miniature components requires fine solder joints; and, finer solder joints require advanced solder pastes with finer particle sizes.
This paper presents our experimental results on the characterization of fine solder powders of Sn-Ag3-Cu0.5 (SAC305) and Sn42-Bi58 (Sn-Bi). The powders investigated in this study were produced with a proprietary atomising technology particularly effective in producing solder powders ranging from 25 to 1 μm which corresponds to Type 5 to Type 10. More specifically, the oxide layer formed on the powder surface is characterized. The thickness and the nature of the chemistry of the surface oxide present are analyzed using Instrumental Gas Analysis (IGA), Auger Electron Spectroscopy (AES) and Transmission Electron Microscopy (TEM). The results on SAC305 and Sn-Bi powders are then compared against each other. |
Proceedings Inclusion? |
Planned: |
Keywords |
Characterization, Electronic Materials, Powder Materials |