About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Finite Element Analysis Modeling of Stress Evolution and Whisker Growth Under Applied Pressure |
Author(s) |
Nupur Jain, Piyush Jagtap, Allan Bower, Eric Chason |
On-Site Speaker (Planned) |
Nupur Jain |
Abstract Scope |
Sn whisker growth is often considered to be a stress driven phenomenon. Through experiments using applied stress, we have quantified the real-time nucleation and growth kinetics in Sn thin films. In this work, we analyze the evolution of the stress under applied load in order to determine its relation to whisker formation kinetics. We have developed a finite element model which accounts for stress evolution due to material diffusion, elasticity, power-law creep and whisker growth mechanisms. The whisker growth kinetics predicted by the model show good agreement with experimental observations. |
Proceedings Inclusion? |
Planned: |