About this Abstract |
Meeting |
2021 TMS Annual Meeting & Exhibition
|
Symposium
|
Electronic Packaging and Interconnections 2021
|
Presentation Title |
Electric-enhanced Sintering of Copper Interconnects |
Author(s) |
Tzu-Hao Shen, Albert T. Wu |
On-Site Speaker (Planned) |
Tzu-Hao Shen |
Abstract Scope |
Due to the development of high power devices, Sn-based alloys are no longer suitable at severe conditions. Copper is a promising candidate for such applications for its high electromigration resistance, excellent electrical conductivity and mechanical properties. Sintering of Cu nanoparticles (CuNPs) is an attractive approach to fabricate joining materials at low temperature and the joints can sustain high-temperature operation. In this study, sintering is enhanced by applying electrical current to CuNPs. Different diameters of CuNPs are made as conductive ink. The ink is printed in V-grooves on Si substrates and pre-sintered at low temperature. Low current density is applied along samples at 150 oC for different durations to further sinter the CuNPs. The morphology and electrical behavior of the sintered CuNPs are studied. Electromigration of the sintered CuNPs is conducted when applying high current density. The results suggest electric-enhanced sintering of CuNPs can be a possible candidate for electronic devices. |
Proceedings Inclusion? |
Planned: |